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Product Information
Asus P5K-E WIFI -AP Edition Motherboard2 in stock ACcode: 2990 £70.00 ex vat £80.50 inc vat
Description
Further information for Asus P5K-E WIFI -AP Edition Motherboard
This motherboard supports the latest Intel 45nm CPU which introduces new micro-architecture features for greater performance at a given frequency, up to 50% larger L2 caches, and expanded power management capabilities for new levels of energy efficiency. This motherboard supports the latest Intel Core2 processors in LGA775 package. It also can support Intel next generation 45nm Multi-Core CPU. With new Intel Core microarchitecture technology and 1333 / 1066 / 800 MHz FSB, Intel Core2 processor is one of the most powerful and energy efficient CPU in the world. The Intel P35 Express Chipset is the latest chipset designed to support the next generation 45nm CPU; and DDR2 800/667 MHz memory architecture. It also supports 1333/1066/800 FSB (Front Side Bus), PCI Express x16 graphics and multi-core CPUs. ATI´s Crossfire boosts image quality along with rendering speed, eliminating the need to scale down screen resolutions to get the high image quality you want. CrossFire ignites with the higher antialiasing, anisotropic filtering, shading, and texture settings you desire. Adjust your display configurations, experiment with your advanced 3D settings, and check the effect with a real-time 3D-rendered preview within ATI´s Catalyst Control Center to rule your CrossFire system. To attain top performance, ASUS engineers have successfully unleashed the true potential of DDR2 memory. While in DDR2 1066 mode, ASUS´s exclusive technology offers a choice of FSB 1333 - providing great performance for 3D graphics and other memory demanding applications.
Genuine 8-Phase Power Design Excels at Power Efficiency The ASUS 8-Phase Power Design provides highly efficient operation to generate less heat (at least 15°C (27°F)) than other conventional power solutions. It reduces input ripple current and output ripple voltage, which keeps CPU and power module from suffering the risk of high power stress. It has the advantages of quick transient response and stability, especially beneficial when CPU requires more current immediately under heavy loading or over clocking mode. The Heat Pipe design effectively directs the heat generated by the chipsets to the heat sink near the back IO ports, where it can be carried away by existing airflow from CPU fan or bundled optional fan. The purpose of the innovative heat pipe design on this motherboard is that the groundbreaking fan less design does not have lifetime problems as a chipset fan does. Furthermore, it provides options for users to install side-flow fan or passive cooler. The Heat Pipe design is the most reliable fan less thermal solution to date. |
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